Basic Information Introduction Team Certification DNA History Company Culture Brand Vision Brand Philosophy Brand Mission Brand Story Huashan Series Chips Huashan A2000 Family Huashan A1000 Family Huashan A1000 Huashan A1000L Huashan A1000 Pro Wudang Series Chips Wudang C1296 Wudang C1236 COMPANY Basic Information Introduction Team Certification DNA History Company Culture Brand Vision Brand Philosophy Brand Mission Brand Story Cooperation Resources TECHNOLOGY IP Core ISP NPU SoC Design Shanhai Toolchain PRODUCTS Huashan Series Chips Huashan A2000 Family Huashan A1000 Family Wudang Series Chips Wudang C1296 Wudang C1236 SesameX Platform Hanhai Middleware SOLUTIONS Driving Solutions V2X Solution Industry Applications Consumer Electronics INVESTOR Listing Documents Financial Reports Announcements & Notices Corporate Governance IR Contact CONTACT US Requests Join US Contacts Leader of Intelligent Vehicle Computing Chips Black Sesame Technologies is a leading provider in automotive-grade computing platform and solutions for smart vehicles. Founded in 2016, Black Sesame Technologies has listed on the main board of the Hong Kong Stock Exchange since 2024, under stock code 2533.HK. The Company started with Huashan Series high-computing power platforms for autonomous driving and released Wudang Series cross-domain platforms in 2023 to address more diverse and sophisticated demands for advanced functionalities in smart vehicles, while also beginning to expand into other applications. Black Sesame Technologies proprietary automotive-grade products and technologies empower smart vehicles with mission-critical capabilities, such as ADAS, smart cockpit, advanced imaging and interconnection. The Company offers full-stack ADAS capabilities to meet broad customer needs through automotive-grade computing platform and solutions, powered by the Company's own IP cores, algorithms and support software. With experience in mass-production of automtive-grade computing platform and intelligent vehicle solutions, the algorithms and technologies are commercially deployed in smart mobility, smart robotics and consumer electronics. Having over 1000 employees worldwide, Black Sesame Technologies established R&D and sales centers in the Silicon Valley, Singapore, Hong Kong and mainland China. Our core team consists of talents from top companies like Bosch, OV, Nvidia, Ambarella, Microsoft, Qualcomm, Huawei and ZTE, with averages 15+ years professional experiences. Black Sesame Technologies consists a team of professionals with more than 20 years of experience in the automotive industry or the IC industry. This team constitutes a unique advantage of Black Sesame Technologies, which knows chips better than the automotive industry and knows cars better than the chip industry. Half of our employees graduated from top universities like Tsinghua University, Shanghai Jiao Tong University, Zhejiang University, Huazhong University of Science and Technology & etc. Our employees hold more than 50 Phd and 300 Master Degrees. Imaging See Clear Our automotive grade ISP provides exceptional image processing capabilities, ensuring that everything on the road is crystal clear. Interconnection See Far Our solution facilitates integration of data from cloud, edge and terminals, providing access to all the traffic information along the road. Intelligence See Through Our automotive grade NPU for deep learning delivers high-performance neural processing capabilities, transforming vehicles into intelligent companions. 2016 Jul. Our inception Sep. Received investment from Northern Light Venture Capital 2018 Mar. Built global strategic partnership with Bosch 2019 Mar. Received investments from SAIC Motor and China Merchants Group Nov. Built strategic partnership with FAW Group 2020 Jun. Launched Huashan A1000 & Huashan A1000L Sep. Received investment from Oceanpine Capital Oct. Launched autonomous driving and V2X solutions 2021 Apr. Received investments from Tencent, Bosch Group and Dongfeng MotorLaunched Huashan A1000 Pro Sep. Built strategic partnership with JAC Motors to develop autonomous driving chips and algorithmsReceived investments from Xiaomi 2022 Jan. Received investments from NIO Capital and Geely Sep. Cooperated agreement with JICA, an affiliate of EcarX, to install Huashan A1000 SoC on Geely vehiclesAwarded project with Utopilot on L4 AGV and heavy truck models Dec. Collaborated with Dongfeng Motor to deploy Huashan A1000 SoCs in its first electric sedan and SUVReached a commercial vehicle platform-level strategic cooperation with SANY 2023 Apr. Chosen by Baidu for domestic intelligent vehicle SoC, developing self-driving products with Huashan A1000Launched the industry's first cross-domain computing platform for intelligent vehicles, Wudang Series, achieving four-domain with single chip May. Collaborated with FAW Group to deploy Huashan A1000L on the Hongqi models Aug. The Geely LYNK&CO 08 with Huahsan A1000 started to sellIveco Olsson equipped with Huashan A1000 to be mass-produced Nov. Empowered the mass-production of EcarX’s first intelligent driving platform 2024 Jan. Unveiled Wudang C1200 family and solutions at CES 2024Built strategic cooperation with LeddarTechJointly developed single-chip NOA parking and driving integrated solution with Nullmax based on the C1200 family Mar. Dongfeng eπ007 with Huashan A1000 started to sell Apr. Launched Wudang C1200 family: C1296, C1236 on Beijing Auto ShowCollaborated with NESINEXT to create cockpit & driving integrated software open platformBuilt strategic cooperation with Tencent CloudCollaborated on intelligent vehicle control with FAW Group based on Wudang C1200 familyStarted to jointly develop cross-domain integrated solution with WindRiver based on the C1200 family for APTIV May. LYNK&CO 07EM-P with Huashan A1000 started to sellLYNK&CO 08EM-P with Huashan A1000 Navigate on Autopilot system started OTA Jun. Dongfeng eπ008 with Huashan A1000 started to sell Aug. Officially listed